Hybrid RF PA Package
Core component of wireless communications
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Hybrid Power AmplifierPackage Process
Developed extra small RF package for the first time in the world
Size: 15 x 16.6mm
- Core technology patented
- No matching circuit needed
- Improved Thermal Performance
- High-Quality Performance
- Faster delivery
- Reduction of defect rate
- Cost reduction in manufacturing and after-service
•Core technology patented
•No matching circuit needed
•High-Quality Performance
•Improved Thermal Performance
Faster delivery
Reduced size and weight
Reduction of defect rate
Cost reduction in manufacturing
and after-service
Our Power Amplifier Packages
WARP Solution doesn't import but developed its own technology resource with PA design techniques and assembly methods (Patents awarded).
GaN Power Transistors
GaN SIMFETs
GaN IMFETs
Doherty PA Package
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Tel. +82-2-532-2555 | Fax. +82-50-8090-2065 | warps@warpsolution.com12F, 56, Seongsuil-ro (BY Center), Seongdong-gu, Seoul, 04782, Republic of Korea
