Hybrid RF PA Package

Core component of wireless communications

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Hybrid Power Amplifier
Package Process
 


Developed extra small RF package for the first time in the world


Size: 15 x 16.6mm


•Core technology patented

•No matching circuit needed

•High-Quality Performance

•Improved Thermal Performance


  Faster delivery

  Reduced size and weight

  Reduction of defect rate

  Cost reduction in manufacturing 

  and after-service


Our Power Amplifier Packages

WARP Solution doesn't import but developed its own technology resource with PA design techniques and assembly methods (Patents awarded). 

GaN Power Transistors

GaN SIMFETs

GaN IMFETs

Doherty PA Package

ABOUT US

Tel. +82-2-532-2555  | Fax. +82-50-8090-2065 | warps@warpsolution.com
12F, 56, Seongsuil-ro (BY Center), Seongdong-gu, Seoul, 04782, Republic of Korea