We provide all the wireless power our customers need.
Warp Solution’s frequency-type power amplifier package is a key component of long-distance wireless charging and 5G networks.
We have our own power amplifier products, and we have our own technology from circuit design to package design and supply products that customers want.
The power conversion (RF to DC: frequency to power conversion) chip is a key component of frequency-based long-distance wireless power transmission technology.
We have global competitiveness with self-developed source technology.
In addition, we have the original patented technology for power amplifier design, and have greatly improved size and cost by providing excellent heat dissipation performance and shortening the manufacturing process.
Products & Applications
Pallet Amplifiers
Wireless Charging Module
5.7GHz~5.9GHz
Size : 50x47x53(mm)
GaN Power Transistor
Packaged Discrete type
Up to 6GHz
Size : 5.1×4.1(mm)
GaN IMFETs
Internally Matched FET
S-Band, X-Band IMFET
Size : 16.6×15(mm)
Doherty PA Packages
High Efficiency Power
Amplifier Package
3.4GHz~3.7GHz
Size : 25×15(mm)
5G SIMFETs
Small Internally
Matched FET
3.4GHz~3.7GHz
Size : 15×8.6(mm)
Power Amps Module
Wide Band PA Module
30MHz~512MHz
Size : 70×38(mm)
Original technology of Warp Solution (in-house chip design and solution development)
Development of a domestic RF package optimized for the environment through multiple analysis
“Optimized for Application
RF package development ”
- High-quality performance
- Improved Thermal Performance
- Alternative for 5G Networks
- Size and Weight Reduced
- Cost-effective
- Faster Delivery
- Custom-designed
- Domestic Technology
Receivers
Warp Solution has developed a power conversion (RF to DC: frequency to power conversion) chip, which is a key component of frequency-based long-distance wireless power transmission technology, with its own technology.
It was developed with power conversion performance of 3W receiving frequency (RF) per chip, and the chip is implemented as a package and applied to the receiver, so it is being applied to commercialization as a miniaturization solution for long-distance wireless power transmission and reception systems.
RF power conversion chip, a non-memory semiconductor, is a highly technology-intensive product for frequency, power conversion, and chip material processing, and is the main product that Warp Solution aims for.
The RF power conversion chip is one of the products that requires a high level of technology and experience in manufacturing, as various technological factors such as frequency and power conversion work complexly. These chips are used in various fields such as wireless communication and wireless charging, and have a great impact on the performance of electronic products.
In particular, RF power conversion chips belong to non-memory semiconductors and are manufactured using CMOS processes. These processes require a high degree of skill and experience, and a lot of effort and technology are required to solve various problems that may occur during the manufacturing process.
Therefore, the RF power conversion chip is one of the highly technology-intensive products, and one of the main products that Warp Solution is aiming for. Through this, Warp Solution maintains a leading position in various wireless communication fields.
The 3W class RF to DC rectifier developed by Warp Solution is implemented as a single chip. Unlike existing RF power conversion chips, this RF receiver, power rectifier, and charge management circuit are all built into one chip, so the overall circuit configuration is simple and can be implemented in a small space.
Additionally, this product is based on gallium nitride (GaN) based technology. GaN is a semiconductor material that can operate stably at high voltage, high frequency, and high temperature, and is attracting attention in the power semiconductor field. RF to DC rectifiers manufactured using this feature increase power conversion efficiency and use less space and parts, contributing to the development of wireless charging technology.
Therefore, the 3W class RF to DC rectifier developed by Warp Solution is a high-efficiency wireless charging technology implemented as a single chip, and is highly anticipated in the field of future smart devices and wireless power transmission.
Road Map
*Development of 200W class transmitter in 2020
Warp Solution’s power conversion (RF to DC) chip is applied to charging modules for smart devices (cell phones, etc.) in 2024, starting with 5W products that aim to apply charging modules for various wearable devices (wireless earphones, etc.) in 2023. We plan to develop a 10W product that can be applied to an electric vehicle charging module in 2026 with a performance of 1KW.
Warp Solution’s RF to DC chip is scheduled to release a 5W product targeting wireless charging module application in 2023, and the product is suitable for low-power wearable devices. These charging modules are expected to be used in small devices such as IoT sensors, wireless earphones, and smart watches.
And the 10W product to be released in 2024 is suitable for large devices such as smartphones, and requires more power. Demand for these products is expected to increase as wireless charging technology becomes more widespread.
Finally, the 1KW class product to be released in 2026 will be applied to the electric vehicle charging module. It is a good choice for large devices that require very high power. These charging modules enable rapid charging of electric vehicles, and demand for this is expected to increase further with the spread of electric vehicles.
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